Recently, Yestech introduced a new machine that uses a 3D x-ray system that permits users to discriminate between the top and bottom sides of boards where there is a high-density of solder joints. The system actually separates the top and bottom images of double sided boards for unimpeded automated inspection of solder joints.
The image below is a sample of what can be done with the system. The first image is a 2D image while the second image is of the top side and the third image is of the bottom side. All of these images were taken on the same spot of the board.
The system can even be integrated with a Yestech AOI inspection system to increase fault coverage for nearly all process defects. The X3 is just as easy to program as Yestech's AOI inspection systems.
As always, let us know if you would like more information.
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